ELECTROSTATIC CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: An electrostatic chuck is provided to decrease a temperature deviation in a center portion and an edge portion of a wafer occurred upon manufacturing a semiconductor memory device by aiding a diffusion of Helium and by increasing a space between the wafer and the chuck for fixing the wafer. CONSTITUTION: An electrostatic chuck in which a wafer is secured, has not less than 6 Helium supply line(34). The Helium supply lines(34) are placed in radial and connected form a center hole portion(31) of the electrostatic chuck to an edge hole portion(32). A width and a depth of the helium supply line(34) is no less than 2 mm. A step in the edge portion of a top of the chuck is 10μm through 40μm.