| 摘要 |
PURPOSE: An apparatus for reclaiming platinum in waste plating solution is provided which is appropriate for reclaiming platinum after platinum plating and selectively extracting platinum only remaining in the plating solution. CONSTITUTION: In a platinum plating apparatus for manufacturing semiconductors, the apparatus for reclaiming platinum comprises a first storage means(10) for receiving a waste plating solution which is generated after platinum is plated on a wafer; a discharging means(20) for discharging a waste plating solution stored in the first storage means; a second storage means(30) which receives and stores the waste plating solution that is discharged from the discharging means; a heat supply means(40) which supplies heat to the second storage means as it envelops the outer side of the second storage means; an exhaust means(50) which exhausts hazardous fume of the waste plating solution generated by heat supplying of the heat supply means; a cleaning means(60) for purifying the hazardous fume exhausted through the exhaust means; and activation means(70a,70b) for activating platinum precipitation reaction of the waste plating solution in the second storage means.
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