| 摘要 |
According to the invention, an individually dimensioned, external conductive layer is applied to the finished circuits, respectively, after testing. The values for a particular electrical characteristic of the circuits, which vary unreliably among the multiple circuits at first after the silicon process, can then be adjusted to a chosen, essentially uniform value. The external layer is dimensioned individually in accordance with the electrical test value established, respectively. This post-adjustment renders redesigning unnecessary. |
