发明名称 ELECTROSTATIC IMPREGNATION OF POWDERS ON SUBSTRATES
摘要 <p>Electrostatic Impregnation Of Powders On SubstratesThe use of electrostatic impregnation to load materials such as binders and flavors onto substrates such as fibers and medical devices is disclosed. Substrates loaded with materials such as binders and flavors, wherein the materials are loaded on the substrates via electrostatic impregnation are also disclosed.</p>
申请公布号 WO2002002245(A2) 申请公布日期 2002.01.10
申请号 US2001018240 申请日期 2001.06.05
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