| 摘要 |
PURPOSE: A method for manufacturing a semiconductor chip package such as a chip-on-board package used for an IC card is provided to reduce manufacturing cost and mounting area by reducing the size of the IC card. CONSTITUTION: A printed circuit board(130), preferably a reel type, is prepared. In the printed circuit board(130), a plurality of chip mounting parts are formed. A semiconductor chip(121) is mounted on each mounting part and then electrically connected to the printed circuit board(130) via a bonding wire(123). The chips(121) mounted on the printed circuit board(130) are entirely molded to form a unified molding part(125). The molding part(125) is then cut by using a rotating drill in H-beam shape, so that the semiconductor chip packages(120) are individually separated. During the separation of the packages(120), outer surfaces of the packages(120) are smoothed with the rotating drill. |
