| 发明名称 |
METHOD OF CONNECTING A DIE IN AN INTEGRATED CIRCUIT MODULE |
| 摘要 |
An integrated circuit module having sockets adapted to receive direct die contact (DDC) dies. Bond pads on each DDC die is arranged such that they are displaced with respect to one another along a particular direction. Each socket of a module includes spring arms adapted to contact the bond pads so configured on the die. The socket includes multiple types of spring arms of varying lengths.
|
| 申请公布号 |
US2002003301(A1) |
申请公布日期 |
2002.01.10 |
| 申请号 |
US19990227869 |
申请日期 |
1999.01.08 |
| 申请人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
发明人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
| 分类号 |
H01L23/48;H01L23/538;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
