Metal interconnections and active matrix substrate using the same

摘要

A ground pattern film 12 for interconnections is formed on a glass substrate 11, and a plating film 13 is formed by selective plating on the ground pattern film 12. A taper angle alpha which both sides of the plating film 13 form with the surface of the glass substrate 11 is made in the range of 0<alpha<90°. This arrangement allows the formation of new metal lines on the plating film 13 without a break and allows the patterning of a new film on the plating film 13 without a remaining film.