| 摘要 |
<p>An apparatus (7) for holding and orienting a wafer (1) having an alignment feature (3), and including a movable robot arm (19); and an end effector (20) attached to an end of the robot arm, the end effector (20) including a gripping mechanism (21a, 21b, 21c) which during operation both holds the wafer and rotates it about an axis that is perpendicular to the plane of the wafer and a sensing element (21) for detecting the alignment feature (3) on the wafer (1) as the gripping mechanism (21a, 21b, 21c) rotates the wafer past the sensing element (21).</p> |
