发明名称 |
CORRUGATED MATRIX HEAT SINK FOR COOLING ELECTRONIC COMPONENTS |
摘要 |
An improved heat sink is used to cool electrical and electronic components that generate heat. The heat sink comprises at least one primary corrugated fin pick having a continuous series of vertically extending fins defining channels between adjacent pairs of the vertically extending fins. A t least one secondary corrugated fin pack fits within the channels of the primary corrugated fin pack, creating a fin pack matrix. The fin pack matrix is then attached to a base plate. |
申请公布号 |
CA2352722(A1) |
申请公布日期 |
2002.01.10 |
申请号 |
CA20012352722 |
申请日期 |
2001.07.09 |
申请人 |
THERMAL FORM & FUNCTION LLC |
发明人 |
FAST, DAVID W. |
分类号 |
H01L23/367;(IPC1-7):H05K7/20;H01L23/36;F28F3/06 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|