ELECTROSTATIC COATING OF MOLDINGS WITH THERMOPLASTIC AND CROSSLINKABLE COPOLYAMIDE HOT-MELT ADHESIVES

摘要

PURPOSE: Provided is an electrostatic coating of nonconductive moldings with a thermoplastic and crosslinkable copolyamide hot-melt adhesives. CONSTITUTION: The thermoplastic hot-melt adhesives may be commercially customary copolyamides based on laurolactam, caprolactam, dicarboxylic acids with C5 to C12 chains and diamines with C5 to C10 chains. Common melting points are between 120 and 140 deg.C. Even for the crosslinkable copolyamides, the same monomer bases are used and reactions with blocked isocyanates may be enabled by modifying the end groups. Following crosslinking, the heat stability is greatly improved(130 to 150 deg.C). The blocked isocyanate is ground and the particle fraction of 1-50 μm is admixed with the copolyamide. The preferred particle size of the mixture is 1- 80 μm.