| 发明名称 |
OPERATION MONITORING METHOD FOR TREATMENT APPARATUS |
| 摘要 |
An operation monitoring method for evaluating the operation of a plasma treatment apparatus (1). Operation data on a plurality of reference wafers (W) is collected by a sensor in advance and the main component analysis is practiced by a controller (10) by using the operation data. The operation of the plasma treatment apparatus (1) is evaluated by using the results of the main component analysis.
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| 申请公布号 |
WO0203441(A1) |
申请公布日期 |
2002.01.10 |
| 申请号 |
WO2001JP05758 |
申请日期 |
2001.07.03 |
| 申请人 |
TOKYO ELECTRON LIMITED;SAKANO, SHINJI;SENDODA, TSUYOSHI |
发明人 |
SAKANO, SHINJI;SENDODA, TSUYOSHI |
| 分类号 |
H01J37/32;H01L21/311;H01L21/66;(IPC1-7):H01L21/306;H01L21/205;C23C16/52 |
主分类号 |
H01J37/32 |
| 代理机构 |
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