| 摘要 |
PURPOSE: A stack type package is provided to decrease a product cost as well as to perform a contact easily by contacting two split outer lead respectively without using a special guide lead. CONSTITUTION: A stack type package includes a package body(10) embedded a semiconductor chip. A lead frame is embedded in the package body, has an inner lead electrically connected to a bond pad of the semiconductor chip, and an outer lead exposed to both side of the package body(10). A plurality of the package body are a stack type which the outer lead is split to two leads, one of the leads is bent upward, the other(22) is bent downward, the outer leads bent upward/downward are contacted to a different package body(10, 10') respectively.
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