| 摘要 |
<p>First to third dielectric layers (201-203) are deposited to form a multilayered dielectric substrate (220). A plurality of conductor patches (204a-204d) are formed on the surface of the first dielectric layer (201). An antenna-feeding microstrip line (205) is formed between the first and second dielectric layers. A ground layer (206) is formed between the second and third dielectric layers (202, 203). Microstrip lines (208a, 208b) for high-frequency circuits are formed on the back of the third dielectric layer (203). The ground layer (206) has a slot (207) though which the antenna-feeding microstrip line (205) and the high-frequency microstrip line (208a) are coupled electromagnetically. Thus, the efficiency and directivity of an antenna are improved.</p> |
