发明名称 |
Pressure sensor has conductive elevations that are arranged in between opposing surfaces of shaft and sensor chip, thereby connecting sensor chip to guides |
摘要 |
Guides (2) extend away from the surface (1a) of a shaft (1). Conductive elevations (8) are formed on the surface (4a) of a sensor chip (4) having a diaphragm (5) that generates an electrical signal corresponding to a physical value. The surfaces (1a,4a) are opposite each other, with the elevations arranged in between such that the sensor chip is connected to the guides through the elevations.
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申请公布号 |
DE10131697(A1) |
申请公布日期 |
2002.01.10 |
申请号 |
DE2001131697 |
申请日期 |
2001.06.29 |
申请人 |
DENSO CORP., KARIYA |
发明人 |
NIDAN, AKIRA;TAKI, TAKAFUMI;HARA, HIDEAKI;MASUDA, MICHIHIRO;BAN, KANAME;TANAKA, KAZUO;MURAKAMI, YOSHIFUMI |
分类号 |
G01L9/04;G01L9/00;H01L29/84;(IPC1-7):G01L9/04 |
主分类号 |
G01L9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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