发明名称 Pressure sensor has conductive elevations that are arranged in between opposing surfaces of shaft and sensor chip, thereby connecting sensor chip to guides
摘要 Guides (2) extend away from the surface (1a) of a shaft (1). Conductive elevations (8) are formed on the surface (4a) of a sensor chip (4) having a diaphragm (5) that generates an electrical signal corresponding to a physical value. The surfaces (1a,4a) are opposite each other, with the elevations arranged in between such that the sensor chip is connected to the guides through the elevations.
申请公布号 DE10131697(A1) 申请公布日期 2002.01.10
申请号 DE2001131697 申请日期 2001.06.29
申请人 DENSO CORP., KARIYA 发明人 NIDAN, AKIRA;TAKI, TAKAFUMI;HARA, HIDEAKI;MASUDA, MICHIHIRO;BAN, KANAME;TANAKA, KAZUO;MURAKAMI, YOSHIFUMI
分类号 G01L9/04;G01L9/00;H01L29/84;(IPC1-7):G01L9/04 主分类号 G01L9/04
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