发明名称 |
METHOD AND APPARATUS FOR FORMING A SILICON WAFER WITH A DENUDED ZONE |
摘要 |
An apparatus and method for forming an epitaxial layer on and a denuded zone in a semiconductor wafer. A single chamber is used to form both the epitaxial layer and the denuded zone. The denuded zone is formed by heating the wafer in the chamber and then rapidly cooling the wafer while it is supported on an annular support whereby only a peripheral edge portion of the wafer is in contact with the support.
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申请公布号 |
WO0203445(A1) |
申请公布日期 |
2002.01.10 |
申请号 |
WO2001US15502 |
申请日期 |
2001.05.14 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
YANG, CHARLES, CHIUN-CHIEH |
分类号 |
H01L21/26;H01L21/322;(IPC1-7):H01L21/322 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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