发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device comprises a first MOSFET and a second MOSFET. The first MOSFET includes a first gate insulating film formed on a semiconductor substrate and having a relatively large thickness and a first gate electrode composed of a polysilicon film formed on the first gate insulating film The second MOSFET includes a second gate insulating film formed on the semiconductor substrate and having a relatively small thickness and a second gate electrode composed of a metal film made of a refractory metal or a compound of a refractory metal and formed on the second gate insulating film.
申请公布号 US2002004270(A1) 申请公布日期 2002.01.10
申请号 US20010931719 申请日期 2001.08.20
申请人 MORIWAKI MASARU;YAMADA TAKAYUKI 发明人 MORIWAKI MASARU;YAMADA TAKAYUKI
分类号 H01L21/8234;H01L21/8247;H01L27/06;H01L27/088;H01L27/105;(IPC1-7):H01L21/824 主分类号 H01L21/8234
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