METHOD FOR PREDICTING CONSUMPTION OF CONSUMABLE PART, METHOD FOR PREDICTING DEPOSITED-FILM THICKNESS, AND PLASMA PROCESSOR

摘要

There has been conventionally no method for predicting the consumption of a consumable part and the deposited film thickness without opening a processing chamber. A method for predicting the consumption of a consumable part used for a plasma processor (10) which subjects a wafer W to a predetermined processing with a plasma generated from a process gas by impressing a high-frequency power and for predicting the thickness of a deposited film is characterized in that the voltages and current of a fundamental wave and a harmonic wave of a high-frequency power source (20) which vary with the thickness of a focus ring (21) and the thickness of the deposited film are measured with time, and measurement data on the voltages and the currents is used for multiple-regressive analysis to predict the thickness of the focus ring (21) and the thickness of the deposited film.