| 摘要 |
A method of etching an underlying inorganic substrate through a patterned photoresist, including exposing a structure comprising said inorganic substrate and patterned photoresist to a plasma etchant generated from a plasma source gas including at least one fluorine-comprising gas and sulfur dioxide (SO2). The amount of sulfur dioxide present in said plasma source gas may be varied during the etching process. The method is particularly useful when the photoresist is a DUV photoresist. One of the preferred embodiments of the method is the etching of silicon nitride (SiNx) through a DUV photoresist, where the plasma source gas used to provide the etchant includes at least one fluorine-comprising gas, argon, and sulfur dioxide. Other preferred fluorine-comprising gases include nitrogen trifluoride (NF3), carbon tetrafluoride (CF4), and sulfur hexafluoride (SF6).
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