发明名称 BONDING METHOD
摘要 <p>A method of easily manufacturing a complete sealingly bonded molded body with ultraprecisely bonding, comprising the steps of (1) fixing the injection molded body (a) to a position (predicted bonding position) formed by a forming mold, (2) moving to put a molded body (b) to be bonded to the injection molded body (a) at the predicted bonding position into the forming mold, (4) positioning the formed body (b) at the predicted bonding position, and (3) closing the forming mold and bonding the molded body (b) to the injection molded body (a).</p>
申请公布号 WO2002002297(P1) 申请公布日期 2002.01.10
申请号 JP2001005728 申请日期 2001.07.02
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址