| 摘要 |
<p>A device for cutting integrated circuit package boards is disclosed. The device includes a circular saw blade (100). A plurality of slots (102) are cut in the circumference of the circular saw blade (100), at least some of the plurality of slots (102) having a depth (do) of at least approximately 2 mm. The blade (200) may have a plurality of first and second slots (202, 204) of different depths (d1, d2) cut in the circumference of the saw blade (200) arranged in an alternating pattern.</p> |
