A CONDITIONING MECHANISM IN A CHEMICAL MECHANICAL POLISHING APPARATUS FOR SEMICONDUCTOR WAFERS

摘要

A method and apparatus for conditioning a polishing pad (12) are described. The method includes steps of providing a chemical mechanical polishing apparatus having a polishing region and a conditioning region; cycling a polishing member (12) through the apparatus; contacting the polishing member (12) in the conditioning region with a conditioning member (50); and conditioning the polishing member (12). The apparatus includes an end effector (70) adapted to receive a conditioning member, the end effector (70) being attached to an arm (65) that can be moved horizontally and vertically, and a strain gauge that monitors the force applied to a polishing member (12).