发明名称 SOI SUBSTRATE AND METHOD AND SYSTEM FOR MANUFACTURING THE SAME
摘要 A method of manufacturing a high-quality bonded SOI substrate is provided. The step of exposing the bonding interface between two substrates is performed in an atmosphere having cleanliness of Class 1 or more in Fed. St. 209D: USA IS standard. A clean room of Class 1 can be obtained using an air filter having a collection efficiency of 99.9999% (6N) or more for dust particles of a size of 0.1 mum or more.
申请公布号 US2002004286(A1) 申请公布日期 2002.01.10
申请号 US19990258951 申请日期 1999.03.01
申请人 CANON KABUSHIKI KAISHA 发明人 ATOJI TADASHI
分类号 H01L21/306;B01D46/48;F24F3/16;H01L21/00;H01L21/02;H01L21/762;H01L27/12;(IPC1-7):C30B1/00;H01L21/30;H01L21/36 主分类号 H01L21/306
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