| 摘要 |
A magazine 12 for storing a plurality of packaged semiconductor integrated circuit devices 10, such as BGA packages, having connection terminals 1 located on a lower surface of the package, includes an elongated housing 9 having a pair of opposite end open mouths fitted with a rubber stopper or a bottle stopper. The housing includes a horizontal bottom plate 6, a pair of first side plates 4 extending from opposite edges of the horizontal bottom plate 6 in an inclined upward direction, a pair of second side plates 5 extending vertically upward from an upper edge of the pair of first side plates 4, respectively, and a horizontal upper plate 7 bridging an upper edge of the pair of second side plates 5. The pair of first side plates 4 have an inclined angle alpha which is necessary and sufficient to ensure that the connection terminals 1 of the semiconductor device 10 never contact with the first side plate 4 and the bottom plate 6 when the semiconductor device 10 is stored in the housing 9.
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