发明名称 MULTI-LAYER INTERCONNECT
摘要 Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.
申请公布号 US2002003303(A1) 申请公布日期 2002.01.10
申请号 US19990432200 申请日期 1999.11.02
申请人 POMMER RICHARD;MCELREA SIMON;BANISTER BRAD 发明人 POMMER RICHARD;MCELREA SIMON;BANISTER BRAD
分类号 H01L21/48;H01L21/66;H01L23/498;H01L23/538;H05K1/02;H05K1/14;H05K3/00;H05K3/22;H05K3/46;(IPC1-7):H01L21/44;H01L23/48 主分类号 H01L21/48
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