发明名称 Intergranular degradation assessment via random grain boundary network analysis
摘要 A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to IGDF.
申请公布号 US2002002865(A1) 申请公布日期 2002.01.10
申请号 US20010780089 申请日期 2001.02.09
申请人 KUMAR MUKUL;SCHWARTZ ADAM J.;KING WAYNE E. 发明人 KUMAR MUKUL;SCHWARTZ ADAM J.;KING WAYNE E.
分类号 G01N17/00;(IPC1-7):G01L1/00;G01B5/30;G01N3/00 主分类号 G01N17/00
代理机构 代理人
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