| 摘要 |
PURPOSE: A plating structure of a printed circuit board is provided to enhance efficiency in use of a substrate by minimizing a plating line and a connection line that occupy the substrate during a plating process. CONSTITUTION: Elements(51) are formed on a substrate(50) in a state of being closely attached to one another, thereby enhancing efficiency in use of the substrate. The first and second inside connection lines(1,2) are facing each other on patterns to be electrically connected when the elements(51) are closely attached to one another. A connection(3) is formed to connect all the elements(51). An external connection line(4) having the connection(3) is formed on an external circumference of the elements. The first and the second connection lines(1,2) are formed to apply a power to all the patterns formed on the elements, respectively. For electric connection of the elements, a grid-type plating line is not used but the first and second connection lines(1,2) are directly used, thereby eliminating waste of the substrate. When the elements are separated after an electrolytic plating process, the first and second connection lines maintain an opened condition inside the elements.
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