ELECTROLYTIC TREATING DEVICE AND ELECTRIC FIELD STATE CONTROL METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic treating device which makes it possible to obtain the in-surface distribution of a desired plating film thickness by positively controlling the electric field state of the surface of a substrate to be treated and an electric field state control method for the same. SOLUTION: A plating liquid 10 is filled between an anode 38 and the substrate W to be treated and a high-resistance structure 4 having the electrical conductivity lower than the electrical conductivity of the plating liquid 10 is installed between the anode 38 and the substrate W to be treated. A band-like insulative member 50 is mounted at the outer periphery of the high-resistance structure 4 in order to lower the current density of the segment near the outer periphery on the surface of the substrate W to be treated when current is passed between the anode 38 and the substrate W to be treated.