| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive resin composition having excellent flexi bility, strength and adhesive property as well as high thermal conductivity and provide a resin sheet made of the resin composition. SOLUTION: This resin composition is composed of a polymer compound (A) having >=2 reactive groups in one molecule, a reactive compound (B) for reacting with the polymer compound (A), and a heat-conductive filler (C).
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