PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP PACKAGE MOUNTED IN WINDOW

摘要

PURPOSE: A printed circuit board(PCB) having a semiconductor chip package mounted in a window is provided to reduce a whole thickness of the PCB wherein the semiconductor chip package is mounted, by using a structure of the PCB in which the semiconductor chip package is inserted into a window. CONSTITUTION: A semiconductor chip(11) having an integrated circuit is encapsulated by a package body(14). A semiconductor chip package(10) has a lead(16,17) electrically connected to the semiconductor chip and exposed from the package body. Metal interconnections form a predetermined circuit. A lead junction pad(21) is bonded to the lead. The semiconductor chip package is inserted into a window(25). The metal interconnections, the lead junction pad and the window are formed on a printed circuit board(20).