发明名称 PACKAGING BUFFER MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a packaging buffer material which can reduce man-hours of packaging work and can save the amount of space during storage and transportation of packaging buffer materials and which can be recovered and reutilized. SOLUTION: The packaging buffer material is disposed between an object to be packaged and an outer box to absorb external forces due to impact or pushing force, and in the buffer material, a plurality of columnar parts are parallelly disposed on a flat plate. The buffer plate includes a first bent groove which is provided on the flat plate approximately in parallel to the columnar part at a location where the buffer material is bent according to the size of the object of be packaged, and a second bent groove in which a V-shaped incision is provided approximately at right angles to the columnar part at a location where the buffer material is bent according to the size of the object. The first and second bent grooves are bent to cover the object so that at least two columnar parts are brought into contact with each side of the object.</p>
申请公布号 JP2002002813(A) 申请公布日期 2002.01.09
申请号 JP20000179339 申请日期 2000.06.15
申请人 NIPPON COLUMBIA CO LTD 发明人 NOHARA YASUHISA
分类号 B65D81/113;(IPC1-7):B65D81/113 主分类号 B65D81/113
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