| 摘要 |
PURPOSE: A method for manufacturing a solder ball of a semiconductor package is provided to omit a lengthy process for growing polymer, by uniformly distributing a plurality of polymer having a fine size inside a solder to form a solder ball without a growth process. CONSTITUTION: A plurality of polymer(10) having a fine size is mixed with a liquid-state solder. The liquid-state solder mixed with the polymer is solidified, and the solidified solder is cut to a predetermined size. After individual solid solders are placed on a ball land of a semiconductor package, a reflow process is performed to make the solid solders of a spherical type.
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