APPARATUS FOR FABRICATING SEMICONDUCTOR

摘要

PURPOSE: An apparatus for fabricating a semiconductor is provided to prevent a leakage of gas due to an O-ring inserted between a rotary shaft and a base plate and pollution due to particles. CONSTITUTION: A drive portion(30) is located at a lower side of a base plate(20) of a flat plate shape. A rotary shaft(31) is connected with an upper side of the drive portion(30). A lower magnetic plate(40) is connected with an upper portion of the rotary shaft(31). A plurality of magnetic body is adhered to an upper portion of the lower magnetic plate(40). An upper magnetic plate(50) is located on an upper side of the base plate(20). The upper magnetic plate(50) has the same shape as the lower magnetic plate(40). A plurality of magnetic body is formed on the upper magnetic plate(50). A rotary plate(60) for loading a wafer(W) is located on an upper side of the upper magnetic plate(50). A support axis(61) is formed on a bottom portion of the rotary plate(60). The lower support plate(40) and the upper support plate(50) are moved within a predetermined region by a guide(70).