EPOXY RESIN COMPOSITION, INSULATION FILM, METAL FOIL WITH RESIN, AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having flame retardancy, hardly generating a toxic substance at the time of combustion, capable of being suitably used for production of a multilayer printed circuit board, hardly causing the cracking or pealing of an insulation layer, and capable of providing the multilayer printed circuit board excellent in electrical reliability and heat resistance. SOLUTION: This epoxy resin composition contains a phosphorus-containing compound (B) obtained by reacting 1.01-2 mol organophosphorus compounds (b) having one active hydrogen bonded to a phosphorus atom with 1 mol quinone compounds, an epoxy resin component (A) comprising epoxy resins (C) represented by general formula (1) (wherein, R1 and R2 are each a hydrogen atom or a phenyl group; m is a positive integer including 0) or the like, and 3-15 wt.% cross-linked elastomer (D) having <=1μm particle diameter based on the whole amount of the epoxy resin component (A).