发明名称 HOT MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a hot melt adhesive which is improved in at least one property among a high flexibility, a low coatable temperature, a low viscosity at the time of coating, a high tackiness-appearing temperature, an outstanding anti-blocking property and a short open time. SOLUTION: This hot melt adhesive contains (A) an ethylene/n-butyl acrylate copolymer, preferably contains additionally (B) a tackifying resin and (C) a wax with a softening point of 120 deg.C or higher, and thus has a composition of 3-60 wt.% of (A) the ethylene/n-butyl acrylate copolymer, 5-50 wt.% of (B) the tackifying resin and 1-30 wt.% of (C) the wax, and most preferably contains additionally 3-15 wt.% of (D) a wax with a softening point of lower than 120 deg.C.
申请公布号 JP2002003804(A) 申请公布日期 2002.01.09
申请号 JP20000183110 申请日期 2000.06.19
申请人 NIPPON NSC LTD 发明人 WATANABE TOMOAKI;ASO KAZUHIRO
分类号 B01D39/00;C09J123/06;C09J123/08;C09J131/04;C09J133/08;C09J157/02;C09J191/06;C09J193/00;C09J193/04;(IPC1-7):C09J123/08 主分类号 B01D39/00
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