发明名称 ADHESIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition, especially an acrylic-based adhesive resin composition, which is excellent in the use for adhesive a molded article made of a non-rigid vinyl chloride resin. SOLUTION: This adhesive resin composition comprises 90-10 wt.% of (A) a resin that contains in the molecule 15-50 wt.% of oxygen atoms and has a glass transition temperature of -20 to 90 deg.C, especially the resin being a copolymer of a methyl methacrylate and a butyl acrylate, and 10-90 wt.% of (B) a polyolefin resin [the sum total of (A) and (B) is 100 wt.%].
申请公布号 JP2002003803(A) 申请公布日期 2002.01.09
申请号 JP20000185280 申请日期 2000.06.20
申请人 SUMITOMO CHEM CO LTD 发明人 FUJITA HARUNORI
分类号 C09J123/02;C09J123/08;C09J133/04;C09J201/06;(IPC1-7):C09J123/02 主分类号 C09J123/02
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