| 摘要 |
A polishing apparatus (70) is used for polishing a workpiece such as a semiconductor wafer (100) to a flat mirror finish. The polishing apparatus (70) comprises a turntable (73) having a polishing surface thereon, and a top ring (75) for holding a workpiece (100) to be polished and pressing the workpiece (100) against the polishing surface on the turntable (73). A pusher (10) is disposed in a position for transferring the workpiece (100) to and from the top ring (75), and has a workpiece support (11) which can be lifted to a position close to the top ring (75) for transferring the workpiece (100) to and from the top ring (75). When the workpiece support (11) receives a polished workpiece (100) and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units (31,32,33) that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece (100) and the lower surface of the top ring (75). |
