Housing semiconductor chips with each chip in a respective frame and conductive members connected to both chip faces

摘要

A housing arrangement for semiconductor chips (eg IGBTs) has each chip (1) received in a respective frame or cassette (4). An electrically conductive member (5) has portions (6) which are in electrical connection with one face of each chips (1), and another electrically conductive member (7) has portions (8) in electrical connection with the opposite face of each chip (1). The electrically conductive members (5,7) may be made of copper, and molybdenum shims (2,3) may be received in frame or cassette (4). The walls of the frame may be shaped to interlock with adjacent frames (Fig.4). Some of the frames (e.g. 42, Fig. 3) may be formed with a channel (10) for receiving a contact pin for each respective chip. The construction of the housing only permits small relative movement of each housing (4), chip (1), and conductive members (6,8) about local axis B-B, the movement being independent of distance from centre line (A-A).