发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, LAYER OF PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME AND METHOD FOR PRODUCING RESIST PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition forming a tack-free surface in the unexposed state, suitable for contact exposure and excellent in photo-curability and alkali developability and to provide a method for producing a resist pattern using the composition. SOLUTION: The photosensitive resin composition contains an aqueous dispersion of a polyurethane oligomer (A) having an anionic hydrophilic group and an ethylenically unsaturated group in one molecule and an aqueous dispersion of a resin (B) having carboxyl groups. A layer of a photosensitive resin composition formed by applying and prebaking the above photosensitive resin composition on a substrate has a tack-free surface in the unexposed state. In the method for producing a resist pattern, the layer is formed on the substrate and imagewise irradiated with active light, the exposed part is photo-cured and the unexposed part is removed by development. |
申请公布号 |
JP2002006485(A) |
申请公布日期 |
2002.01.09 |
申请号 |
JP20000192883 |
申请日期 |
2000.06.27 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
IN AKIRA;KAMITSURA MASAYOSHI;SHIODA MAKOTO |
分类号 |
G03F7/027;C08F2/44;C08F2/50;C08F299/06;C08L33/00;C08L55/00;C08L101/08;C08L101/14;G03F7/032;G03F7/033 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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