发明名称 METHOD FOR MANUFACTURING SUBSTRATE AND PLATING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing substrate which is capable of suppressing trouble, such as discoloration and degradation in joint strength, arising on the surfaces of plating layers consisting of base metals and a plating device. SOLUTION: The method for manufacturing the substrates 1 having the plating layers consisting of the base metals has a plating immersion process step of forming the plating layers consisting of the base metals by immersing the substrate 1 into a plaiting tank 3 and a plating cleaning process step of cleaning the substrates by taking out the substrates out of the plating tank 33 and moving the same. The method has also a cooling process step of cooling the substrates 1 by applying a cooling liquid to the substrates 1 during the period of at least part of the period when the substrates are moved to a position where the plating cleaning process step is carried out after the plating immersion process step.</p>
申请公布号 JP2002004098(A) 申请公布日期 2002.01.09
申请号 JP20000183126 申请日期 2000.06.19
申请人 NGK SPARK PLUG CO LTD 发明人 IBA MASAHIRO;WAKAKO HISASHI;SATO KAZUHISA;HASHIMOTO HIROYUKI;DOI YASUO
分类号 C25D5/48;C25D17/08;C25D21/02;C25D21/12;H01L21/00;H01L21/288;H01L21/60;H05K3/18;H05K3/24;(IPC1-7):C25D21/02 主分类号 C25D5/48
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