| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that bend or damages are easily generated in external lead terminals of a package for storing a pin grid array type semiconductor devices by the contact with a jig, and the jig cannot be used repeatedly. SOLUTION: In this plating jig, a plurality of pairs of contact arms 2 having contact parts 2a for holding the external lead pins 23 facing each other at intervals smaller than the diameter of the external lead pins 23 are erected in a row corresponding to the array of the external lead pins 23 in a plate-like substrate formed of a metal plate. The contact arms 2 have appropriate spring property, and the external lead pins 23 can be inserted between the contact arms 2 and brought into contact with these contact arms 2. |
