| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having low moisture absorption, a low birefringence and a low dielectric constant, excellent in fluidity, little in change of color when being heated, and excellent in mold-releasability at the time of injection molding. SOLUTION: This resin composition comprises the following polymers (A) and (B), diphenylsilicone and a phenolic antioxidant: (A) a polymer containing one or more kinds of indene or an indene derivative, represented by general formula (1) (wherein, R1, R2, R3, R4, R5 and R6 may be same or different, and are each a hydrogen atom, a monovalent hydrocarbon group containing a nitrogen atom, an oxygen atom or a silicon atom, a 1-6C alkyl group, a monovalent aromatic hydrocarbon group; X is a hydrogen atom, a halogen atom, an acyl group, an alkoxy group or a nitrile group; x is O or an integer of 1-4; y is an integer of 1-4; with the proviso that x+y =4), and having a carboxy group and/or a phenolic hydroxy group on the side chain; and (B) a polymer composed of a styrene or a styrene derivative, and a copolymerizable monomer, and having a heterocyclic structure and/or an alkylamino group on the side chain.
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