发明名称 |
ARRANGEMENT AND METHOD FOR TRIMMING ELECTRONIC COMPONENTS ON A SUBSTRATE |
摘要 |
A method and apparatus for trimming a discrete surface-mounted component or a component integrated in a substrate including providing a trimmable structure mounted on the surface of a substrate for each component to be trimmed. In an exemplary embodiment, the component to be trimmed is a capacitor. In another exemplary embodiment, the trimmable structure is one electrode of a trimmable capacitor whose other electrode is integrated in the substrate, and the trimmable capacitor is connected in parallel with a surface mounted capacitor to be trimmed. |
申请公布号 |
EP1169718(A1) |
申请公布日期 |
2002.01.09 |
申请号 |
EP20000919192 |
申请日期 |
2000.02.18 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON |
发明人 |
OLOFSSON, LARS-ANDERS |
分类号 |
H01C17/22;H01C17/242;H01G13/00;H05K1/00;H05K1/02;H05K1/11;H05K1/16;H05K1/18;H05K3/02;(IPC1-7):H01C17/22;H01G4/224 |
主分类号 |
H01C17/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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