发明名称 HIGHLY HEAT CONDUCTIVE COMPOSITION AND ITS APPLICATION
摘要 PROBLEM TO BE SOLVED: To obtain a highly heat-conductive composition fluidizing at a specified temperature, excellent in heat radiation and low in heat resistance, and to provide a radiating member capable of microscopically adhering to the respective surfaces to be joined of exothermic electronic parts and radiating fins. SOLUTION: The heat-conductive composition is characterized in that it is a mixture of wax and/or paraffin with the melting point at 40-100 deg.C, a thermoplastic resin softening at 40-100 deg.C, and spherical alumina having a sphericity of 0.78 or higher and an average grain diameter of 3 μm or more. A radiating member fox exothermic electronic parts and an exothermic electronic part structure integrated with radiating fins are provided by suing this composition.
申请公布号 JP2002003830(A) 申请公布日期 2002.01.09
申请号 JP20000190767 申请日期 2000.06.26
申请人 DENKI KAGAKU KOGYO KK 发明人 SATO MIKITOSHI;KAWANO MASATO;KAWASAKI TAKU
分类号 C08J5/18;C08K7/18;C08L91/06;C08L101/00;C09K5/08;H01L23/36;H01L23/373;H05K7/20 主分类号 C08J5/18
代理机构 代理人
主权项
地址