PLATING FILM AND SOLDERING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a soldering method which allows the use of current devices and makes it possible to obtain high-quality soldering even after soldering without flux. SOLUTION: A member 1 to be joined is subjected to bright electroplating to form a first plating layer 2a Figure (a)} and a second plating layer 2b co-deposited with hydrogen, by which the plating film 2 is obtained Figure (b)}. The hydrogen 3 co-deposited thus far in the second plating layer is thermally diffused by solder 6 to reduce the oxygen of an oxidized film 4 coating the surface of the second plating layer 2b to water molecules 5 Figure (c)} to form an intermetallic compound 7, by which soldering is effected Figure (d)}.