| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroforming device which is capable of rapidly forming high-quality plating films without entailing the decomposition of a plating liquid. SOLUTION: This electroforming device has a housing section 150 which houses the plating liquid, a cathode section 120 which is arranged in this housing section and has a plating object to be subjected to plating and an anode section 140 which is arranged in the housing section and is arranged to face the cathode section. The energizing opening area of the anode section is formed larger than the energizing opening area of the cathode section. |
