EPOXY RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing capable of providing a one-side sealing type package having low warp and excellent re-flow characteristics, and to provide a one-side sealing type semiconductor device having low warp and excellent reflow characteristics sealed by using the epoxy resin composition for sealing. SOLUTION: This epoxy resin composition comprises at least one epoxy resin expressed by either of formulae (1) and others, and comprises at a curing agent a phenol-novolak resin in which 0 to 10 wt.% of bi-nuclear material is contained.