发明名称 METHOD AND DEVICE FOR SUBSTRATE TREATMENT AT LEAKING PART OF CONCRETE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for substrate treatment at leaking part of concrete structure by which not only leakage water can be conveyed quickly and surely, but also substrate treatment can be performed inexpensively, at the leaking part of a concrete structure without compromising the fine surface view of the structure. SOLUTION: The substrate treatment for surface finishing, such as the painting, lining, etc., is performed on the leaking part of the concrete structure 1 by eliminating water flows from the surface of the structure 1 by forcibly conveying the leakage water from the crack K of the structure 1 by means of a vacuum generating device, such as a sucking apparatus 2, ejector 3, etc.
申请公布号 JP2002004318(A) 申请公布日期 2002.01.09
申请号 JP20000190789 申请日期 2000.06.26
申请人 NIPPON KAYAKU WASSER KK 发明人 TERAYAMA AKIRA
分类号 E02D31/02;E21D11/38;(IPC1-7):E02D31/02 主分类号 E02D31/02
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