发明名称 OVAL HOLE MACHINING METHOD AND ITS APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an oval hole machining method and its apparatus capable of forming an arbitrary size of oval hole applied to many kinds of processing materials with high speed and exactness even in a low power laser oscillator. SOLUTION: A prism 3, having a plane of incidence 3a which refracts incident rays into a prism 3 and a plane of reflection 3b which totally reflects the incident light and a plane of radiation 3c which refracts the reflected light to radiate out of the prism 3, is rotated around a prescribed rotating shaft 4. And a laser beam A is irradiated into this rotating prism 3 from a position deviated from the rotating shaft 4, collecting the radiation light from the prism 3 and scanning around a processed material 7 in oval-shape to form a pierced oval hole 8.</p>
申请公布号 JP2002001561(A) 申请公布日期 2002.01.08
申请号 JP20000188528 申请日期 2000.06.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KASAI TAKAAKI;FUNEMI KOJI;NAKABASHI AKIHISA
分类号 G02B5/04;B23K26/00;B23K26/06;B23K26/08;B23K26/38;G02B7/18;H05K3/00;(IPC1-7):B23K26/00 主分类号 G02B5/04
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