发明名称 CUTTING DEVICE FOR CERAMIC LAMINATE
摘要 PROBLEM TO BE SOLVED: To improve productivity of a cutting step and a dimensional accuracy of a cut piece in steps of manufacturing an electronic component made of a ceramic laminate. SOLUTION: Steel wires for cutting are disposed in a frame having an ultrasonic vibrating mechanism or a heating mechanism, and ultrasonically vibrated or heated to soften a binder contained in the laminate of parts contacted with the wires to facilitate the cutting.
申请公布号 JP2002001720(A) 申请公布日期 2002.01.08
申请号 JP20000186594 申请日期 2000.06.21
申请人 TOKIN CORP 发明人 WATABE YOHEI
分类号 B26F3/00;B26F3/12;B28B11/14;B28D5/04;(IPC1-7):B28B11/14 主分类号 B26F3/00
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