发明名称 DEVICE AND METHOD FOR DISPERSION OF SOLDERING PASTE
摘要 PROBLEM TO BE SOLVED: To provide a device and method for dispersion of soldering paste capable of enhancing dispersibility in the soldering paste which is stored inside syringes more than a conventional one. SOLUTION: A dispersion device 10 has a pair of syringes 12 and 22 wherein the soldering paste is stored. Orifices 14 and 24 of a pair of syringes 12 and 22 are connected by a connector 20. Plungers 16 and 26 of the syringes 12 and 22 are driven by driving devices 18 and 28. Air inside the connector and the syringes is removed by means of a duration means.
申请公布号 JP2002001528(A) 申请公布日期 2002.01.08
申请号 JP20000182481 申请日期 2000.06.19
申请人 MURATA MFG CO LTD 发明人 MORI HIROAKI
分类号 B05D1/26;B05C5/00;B05C11/10;B05D7/00;B23K3/08;(IPC1-7):B23K3/08 主分类号 B05D1/26
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